The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2005
Filed:
Jul. 20, 2001
Kuno Wolf, Jungingen, DE;
Alexander Wallrauch, Gomaringen, DE;
Horst Meinders, Reutlingen, DE;
Barbara Will, Herrenberg, DE;
Peter Urbach, Reutlingen, DE;
Kuno Wolf, Jungingen, DE;
Alexander Wallrauch, Gomaringen, DE;
Horst Meinders, Reutlingen, DE;
Barbara Will, Herrenberg, DE;
Peter Urbach, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.