The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2005
Filed:
Feb. 05, 2004
Mitsurou Moriya, Ikoma, JP;
Shin-ichi Tanaka, Kyoto, JP;
Yasuhiro Sugihara, Katano, JP;
Hiroshi Taniguchi, Hirakata, JP;
Michiyoshi Nagashima, Ikoma, JP;
Mitsurou Moriya, Ikoma, JP;
Shin-ichi Tanaka, Kyoto, JP;
Yasuhiro Sugihara, Katano, JP;
Hiroshi Taniguchi, Hirakata, JP;
Michiyoshi Nagashima, Ikoma, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
A reproduction apparatus is provided for reproducing information stored on an optical medium. The apparatus includes a light source for illuminating the optical medium, the optical medium having at least one surface containing information stored thereon; a focusing arrangement operable to focus the light source on the at least one surface containing information thereon; and a detection arrangement operable to detect the information stored on the optical medium. The optical medium includes a first substrate having a first information surface; a semitransparent reflection film formed on the first information surface of the first substrate; a second substrate having a second information surface; a reflection film formed on the second information surface of the second substrate; and an adhesive layer for adhering the first substrate and the second substrate so that the first information surface and the second information surface face each other, wherein the thickness of the first substrate is at least 0.56 mm, the thickness of the adhesive layer is at least 30 μm, the total thickness of the first substrate and the adhesive layer is in the range of 0.59 mm to 0.68 mm, and the adhesive layer includes a thermosetting material.