The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2005

Filed:

Jun. 05, 2001
Applicants:

Takayuki Kamemura, Chichibu, JP;

Kazuhiro Mitani, Chichibu, JP;

Teruyuki Kobayashi, Chichibu, JP;

Nobuo Uotani, Chiba, JP;

Kasumi Nakamura, Chiba, JP;

Yuji Itoh, Chiba, JP;

Inventors:

Takayuki Kamemura, Chichibu, JP;

Kazuhiro Mitani, Chichibu, JP;

Teruyuki Kobayashi, Chichibu, JP;

Nobuo Uotani, Chiba, JP;

Kasumi Nakamura, Chiba, JP;

Yuji Itoh, Chiba, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/00 ; H01L029/22 ; H01L029/227 ;
U.S. Cl.
CPC ...
Abstract

A small-sized semiconductor light-emitting device of high emission directivity and high output is provided. A portion of a light extraction section of a semiconductor light-emitting device including a pn-junction portion is covered with a light-shielding substance of low conductivity. The electrical resistance of the light-shielding substance is 10Ωm or higher, and the substance contains powder of at least one species selected from metals and pigments. The powder of metal contains at least one species selected from among Al, Cu, Ag, Au, Pt, Ti, Ni, Sn, Pb, Mg, Zn, Fe, Co, and Cr. The powder is a plate-like powder having a thickness falling within a range of 0.001-10 μm and a length falling within a range of 0.01-100 μm.


Find Patent Forward Citations

Loading…