The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2005
Filed:
Apr. 14, 2003
Applicant:
Mark M. Konarski, Old Saybrook, CT (US);
Inventor:
Mark M. Konarski, Old Saybrook, CT (US);
Assignee:
Henkel Corporation, Rock Hill, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G059/50 ; C08L063/00 ; C08L063/02 ; C08L063/04 ;
U.S. Cl.
CPC ...
Abstract
A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine groups wherein the weight ratio of epoxy resin:adhesion promotor being from about 2:1 to about 20:1, (c) a curative of a nitrogen-containing compound and a transition metal complex; and, optionally, a polysulfide toughening agent.