The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2005
Filed:
Jan. 27, 2003
Scott K. Pozder, Austin, TX (US);
Trent S. Uehling, New Braunfels, TX (US);
Lakshmi N. Ramanathan, Chandler, AZ (US);
Scott K. Pozder, Austin, TX (US);
Trent S. Uehling, New Braunfels, TX (US);
Lakshmi N. Ramanathan, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A process for removing metal from a scribe area of a semiconductor wafer. The metal removed may include exposed metal in a saw path of the scribe area and the metal in a crack stop trench of the scribe area. In one example, copper is removed from the scribe area by wet etching the wafer. In one example, the wet etching process is performed after the removal of an exposed barrier adhesion layer on the wafer surface. Removal of the metal in the saw path may reduce the amount of metal buildup on a saw blade during singulation of the die areas of a wafer.