The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2005
Filed:
Mar. 20, 2002
Yoshiaki Shinjo, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Eiji Yoshida, Kawasaki, JP;
Noboru Hayasaka, Kawasaki, JP;
Mitsuhisa Watanabe, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Eiji Yoshida, Kawasaki, JP;
Noboru Hayasaka, Kawasaki, JP;
Mitsuhisa Watanabe, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of making a semiconductor device includes a back-grinding step of grinding a back surface of a semiconductor substrate, a dicing step of dicing the semiconductor substrate along predetermined dicing lines so as to make pieces of semiconductor devices after the back-grinding step, and a laser exposure step of shining laser light on the back surface of the semiconductor substrate after the back-grinding step so as to remove grinding marks generated by the back-grinding step.