The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
May. 19, 2003
Masanobu Ujiie, Fukushima-ken, JP;
Atsushi Murata, Fukushima-ken, JP;
Daijo Shibata, Fukushima-ken, JP;
Kiminori Terashima, Fukushima-ken, JP;
Masanobu Ujiie, Fukushima-ken, JP;
Atsushi Murata, Fukushima-ken, JP;
Daijo Shibata, Fukushima-ken, JP;
Kiminori Terashima, Fukushima-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.