The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Apr. 21, 2003
Clem H. Brown, Scottsdale, AZ (US);
Wai Wong Chow, Sheung Shui, HK;
Frank J. Mosna, Jr., Tempe, AZ (US);
Clem H. Brown, Scottsdale, AZ (US);
Wai Wong Chow, Sheung Shui, HK;
Frank J. Mosna, Jr., Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor component for electrical coupling to a substrate () includes: a semiconductor chip (); a non-leaded leadframe () including a plurality of electrical contacts () located around a periphery () of the semiconductor chip; a first electrical conductor () electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound () disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface () having a first surface area for electrically coupling to the semiconductor chip; and a second surface () opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.