The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Sep. 23, 2002
Cao Minh Thai, Yokohama, JP;
Hiroshi Tateishi, Yokohama, JP;
Koichi Teshima, Tokyo, JP;
Masahiro Tadauchi, Tokyo, JP;
Izuru Komatsu, Yokohama, JP;
Tetsuji Hori, Yokohama, JP;
Cao Minh Thai, Yokohama, JP;
Hiroshi Tateishi, Yokohama, JP;
Koichi Teshima, Tokyo, JP;
Masahiro Tadauchi, Tokyo, JP;
Izuru Komatsu, Yokohama, JP;
Tetsuji Hori, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.