The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Nov. 06, 2003
Applicant:
Hyoun Soo Shin, Seoul, KR;
Inventor:
Hyoun Soo Shin, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., LTD, Kyungki-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L033/00 ;
U.S. Cl.
CPC ...
Abstract
A GaN light emitting diode for flip-chip bonding, with sufficient bonding area, optimized electrode arrangement, and improved brightness and reliability, includes n-electrodes and a p-electrode which are formed as stripes. The n-electrodes are positioned at equal distances from the p-electrode and arranged in parallel, thus the electric current is not concentrated into a predetermined portion, but uniformly flows through the light emitting diode without reducing a light emitting area.