The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Jan. 10, 2003
James M. Pak, Sunnyvale, CA (US);
Steven J. Zika, Austin, TX (US);
James M. Pak, Sunnyvale, CA (US);
Steven J. Zika, Austin, TX (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method for detecting sequential processing effects on integrated circuits to be manufactured in a manufacturing process, includes: determining a first random sequence for a plurality of wafers; performing a first process step on the plurality of wafers by a first process tool in accordance with the first random sequence; determining a second random sequence for the plurality of wafers; and performing a second process step on the plurality of wafers by a second process tool in accordance with the second random sequence. The method performs randomization of wafer processing sequences at the process tool itself. By performing randomization of wafer processing sequences at the process tool, the need for separate wafer handlers is eliminated, resulting in significant cost reduction, clean-room space savings, improved yield, improved manufacturing cycle time, and improved signal-detection capabilities.