The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Jan. 10, 2003
Hans Hesse, Paderborn, DE;
Hans Hesse, Paderborn, DE;
Hesse & Knipps GmbH, Paderborn, DE;
Abstract
In the forms of a flip-chip package in which the contact elements of the chip are ultrasonically welded to the contact elements of the substrate, either the chip or the substrate or both are provided, prior to juxtaposition, with a bonding material which can be ultrasonically activated. During the ultrasonic welding process in which the contact elements of the chip and substrate are bonded together, the bonding material provides an additional attachment between the chip and substrate and eliminates the need for underfilling.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile