The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

Apr. 27, 2001
Applicants:

Katsuhiko Higashino, Settsu, JP;

Hiroyuki Tanaka, Settsu, JP;

Takafumi Yamato, Settsu, JP;

Tsuyoshi Noguchi, Settsu, JP;

Inventors:

Katsuhiko Higashino, Settsu, JP;

Hiroyuki Tanaka, Settsu, JP;

Takafumi Yamato, Settsu, JP;

Tsuyoshi Noguchi, Settsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L027/12 ; C08L027/18 ; C08L027/20 ; C08K009/00 ; C08K009/06 ;
U.S. Cl.
CPC ...
Abstract

There is provided an elastomer composition which is prepared by using a very clean filler reduced in both of an amount of moisture generation and an amount of organic outgas generation and is suitable as a molding material for semiconductor production apparatuses and there is provided a molded article. The composition is a crosslinkable composition comprising a high molecular weight polymer, particularly a crosslinkable fluorine-containing elastomer and a filler which has a weight reduction ratio per unit surface area of not more than 2.5×10% by weight/mwhen heating at 200° C. for two hours and a total amount of organic gas generated of not more than 2.5 ppm when heating at 200° C. for 15 minutes. The molded article is produced from the crosslinkable composition.


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