The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

Dec. 17, 2002
Applicants:

Sumiya Miyake, Yokohama, JP;

Akiko Okubo, Kawasaki, JP;

Hiromi Honda, Utsunomiya, JP;

Yoshiyuki Go, Kawasaki, JP;

Hiroshi Nagata, Yokohama, JP;

Minoru Kobayashi, Kawasaki, JP;

Inventors:

Sumiya Miyake, Yokohama, JP;

Akiko Okubo, Kawasaki, JP;

Hiromi Honda, Utsunomiya, JP;

Yoshiyuki Go, Kawasaki, JP;

Hiroshi Nagata, Yokohama, JP;

Minoru Kobayashi, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J031/20 ; B01J031/22 ; C08G059/68 ; C08K063/04 ;
U.S. Cl.
CPC ...
Abstract

This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermo-setting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.


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