The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6946234 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 20, 2005

Filed:

Jul. 28, 2003
Applicants:

Genji Imai, Kanagawa, JP;

Ritsuko Fukuda, Kanagawa, JP;

Toshiro Takao, Kanagawa, JP;

Keiichi Ikeda, Kanagawa, JP;

Yoshihiro Yamamoto, Kanagawa, JP;

Inventors:

Genji Imai, Kanagawa, JP;

Ritsuko Fukuda, Kanagawa, JP;

Toshiro Takao, Kanagawa, JP;

Keiichi Ikeda, Kanagawa, JP;

Yoshihiro Yamamoto, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03C001/492 ;
U.S. Cl.
CPC ...
Abstract

A pattern can be precisely formed by irradiating, with an active energy beam, a positive sensitive resin composition according to this invention comprising a base polymer, an ether-bond-containing olefinic unsaturated compound and an acid-generating agent, where the base polymer is a copolymer comprising the structural units represented by formulas (1) to (3): where Rand Rare each independently hydrogen or methyl and Ris C-Cstraight or branched unsubstituted alkyl or C-Cstraight or branched substituted alkyl, wherein a, b and c are 0.05 to 0.7, 0.15 to 0.8 and 0.01 to 0.5, respectively and a+b+c=1.


Find Patent Forward Citations

Imai, Genji. (2005). Positive sensitive resin composition and a process for forming a resist pattern therewith (U.S. Patent No. 6946234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6946234

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