The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Feb. 27, 2004
David A. Trout, Lancaster, PA (US);
Jeffrey B. Mcclinton, Harrisburg, PA (US);
Keith M. Murr, Etters, PA (US);
Peter C. O'donnell, Dillsburg, PA (US);
Hollis P. Raymond, Mechanicsburg, PA (US);
David B. Sinisi, Harrisburg, PA (US);
Attalee S. Taylor, Palmyra, PA (US);
Andrew D. Balthaser, Dauphin, PA (US);
Richard N. Whyne, Camp Hill, PA (US);
Darrell L. Wertz, York, PA (US);
David A. Trout, Lancaster, PA (US);
Jeffrey B. McClinton, Harrisburg, PA (US);
Keith M. Murr, Etters, PA (US);
Peter C. O'Donnell, Dillsburg, PA (US);
Hollis P. Raymond, Mechanicsburg, PA (US);
David B. Sinisi, Harrisburg, PA (US);
Attalee S. Taylor, Palmyra, PA (US);
Andrew D. Balthaser, Dauphin, PA (US);
Richard N. Whyne, Camp Hill, PA (US);
Darrell L. Wertz, York, PA (US);
Tyco Electronics Corporation, Middletown, PA (US);
Abstract
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.