The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Jun. 06, 2003
Dana J. Medlin, Warsaw, IN (US);
Steven J. Charlebois, Goshen, IN (US);
William Clarke, Warsaw, IN (US);
Dirk L. Pletcher, Walkerton, IN (US);
Joel G. Scrafton, Leesburg, IN (US);
H. Ravindranath Shetty, Warsaw, IN (US);
Dale Swarts, Warsaw, IN (US);
Dana J. Medlin, Warsaw, IN (US);
Steven J. Charlebois, Goshen, IN (US);
William Clarke, Warsaw, IN (US);
Dirk L. Pletcher, Walkerton, IN (US);
Joel G. Scrafton, Leesburg, IN (US);
H. Ravindranath Shetty, Warsaw, IN (US);
Dale Swarts, Warsaw, IN (US);
Zimmer Technology, Inc., Chicago, IL (US);
Abstract
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer; providing a dense metal substrate; providing a binding mixture; applying the binding mixture to the exterior of the substrate; placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly; and heat treating the assembly to metallurgically bond the porous layer to the substrate.