The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

May. 19, 2003
Applicants:

Kinji Hirai, Kawasaki, JP;

Hisayuki Fukada, Shizuoka, JP;

Yuuji Osada, Kanagawa, JP;

Inventors:

Kinji Hirai, Kawasaki, JP;

Hisayuki Fukada, Shizuoka, JP;

Yuuji Osada, Kanagawa, JP;

Assignee:

Takata Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D017/12 ; B22D039/00 ;
U.S. Cl.
CPC ...
Abstract

An injection molding apparatus includes a melt furnace and a metal supply system located in the melt furnace. The metal supply system includes a pump. The injection molding apparatus also includes a first metal inlet from the melt furnace to the metal supply system and a vertical injection mechanism adapted to inject liquid metal into a die system. The injection molding apparatus also includes a second metal inlet from the metal supply system to the vertical injection mechanism.


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