The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

May. 20, 2004
Applicants:

Akira Maeda, Dazaifu, JP;

Tetsuya Tanaka, Kurume, JP;

Yuji Otake, Fukuoka, JP;

Seiichi Miyahara, Kurume, JP;

Inventors:

Akira Maeda, Dazaifu, JP;

Tetsuya Tanaka, Kurume, JP;

Yuji Otake, Fukuoka, JP;

Seiichi Miyahara, Kurume, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C017/04 ; B41M001/12 ; B41L003/02 ;
U.S. Cl.
CPC ...
Abstract

A screen printing apparatus and method in that in the print parameter setting process for setting print parameters including a squeegee movement speed, a printing pressure, and plate release conditions, a squeegee movement speed at which the squeegee is to be moved is set at the first step, then a printing pressure for realizing a desired cream solder charging state is set at the second step, and then plate release conditions for realizing a desired cream solder transfer state is set at the third step. Therefore, the print parameter setting process can be performed according to an efficient processing procedure and trial-and-error-based backward work can be avoided. Print parameters can be set quickly and properly for a wide range of solder types.


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