The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Jan. 15, 2002
Kazuhiro Nobori, Katano, JP;
Satoshi Ikeda, Suita, JP;
Yasushi Kato, Kyoto, JP;
Yasufumi Nakajima, Hirakata, JP;
Kazuhiro Nobori, Katano, JP;
Satoshi Ikeda, Suita, JP;
Yasushi Kato, Kyoto, JP;
Yasufumi Nakajima, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby wiring lines are eliminated. Stray inductance and conduction resistance resulting from wiring lines can be reduced. A conventional dented connector and a projecting connector are eliminated by connecting the installation members to a second circuit board, thereby enabling an electronic circuit device of a power control system to be made compact.