The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Dec. 23, 2002
Hiroshi Horiuchi, Kawasaki, JP;
Tamotsu Yamamoto, Kawasaki, JP;
Yukio Takigawa, Kawasaki, JP;
Shigeru Suzuki, Kawasaki, JP;
Nobuaki Santo, Kawasaki, JP;
Motoshu Miyajima, Kawasaki, JP;
Hiroshi Horiuchi, Kawasaki, JP;
Tamotsu Yamamoto, Kawasaki, JP;
Yukio Takigawa, Kawasaki, JP;
Shigeru Suzuki, Kawasaki, JP;
Nobuaki Santo, Kawasaki, JP;
Motoshu Miyajima, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method is provided for manufacturing a semiconductor device having a multilayer wiring structure in which at least one insulating film is formed with a set of conducting portions which are electrically connected to each other to have a surface area of no less than 500 μmand which include a wiring having a width of no more than 1.0 μm. The method includes a polishing step for flattening the conducting portions together with the insulating film by chemical mechanical polishing, a chemical cleaning step for cleaning the flattened surface of the insulating film with a cleaning liquid, and a rising step for removing the cleaning liquid using a rinsing liquid. The rinsing step is performed using water with a dissolved oxygen concentration decreased to no more than 6 ppm by weight as the rinsing liquid.