The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6943100 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 13, 2005

Filed:

Oct. 15, 2003
Applicants:

Akira Chinda, Ibaraki, JP;

Akira Matsuura, Ibaraki, JP;

Inventors:

Akira Chinda, Ibaraki, JP;

Akira Matsuura, Ibaraki, JP;

Assignee:

Hitachi Cable, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/48 ; H01L023/48 ; H01R043/16 ;
U.S. Cl.
CPC ...
Abstract

In a writing board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principle plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.


Find Patent Forward Citations

Chinda, Akira. (2005). Method of fabricating a wiring board utilizing a conductive member having a reduced thickness (U.S. Patent No. 6943100). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6943100

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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