The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
May. 16, 2002
Stanton James Dent, Midland, MI (US);
Lyndon James Larson, Auburn, MI (US);
Robert Thomas Nelson, Bay City, MI (US);
Debra Charilla Rash, Santa Cruz, BO;
Stanton James Dent, Midland, MI (US);
Lyndon James Larson, Auburn, MI (US);
Robert Thomas Nelson, Bay City, MI (US);
Debra Charilla Rash, Santa Cruz, BO;
Dow Corning Corporation, Midland, MI (US);
Abstract
A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 μm/m° C. between −40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.