The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
May. 22, 2002
Tadashi Kawanobe, Tokyo, JP;
Yasuharu Kameyama, Tokyo, JP;
Masayuki Hosono, Tokyo, JP;
Kazumoto Komiya, Tokyo, JP;
Akiji Shibata, Tokyo, JP;
Tadashi Kawanobe, Tokyo, JP;
Yasuharu Kameyama, Tokyo, JP;
Masayuki Hosono, Tokyo, JP;
Kazumoto Komiya, Tokyo, JP;
Akiji Shibata, Tokyo, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.