The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Jul. 16, 2004
Naomi Ishizuka, Tokyo, JP;
Eiichi Kono, Tokyo, JP;
Naomi Ishizuka, Tokyo, JP;
Eiichi Kono, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The present invention provides a board ensuring no peel-off of a wall and a land, even if a part is soldered to the board with lead-free solder. The boardis comprised of N (N≧3) layer patterns electrically insulated from one another, and is formed with a through-holeinto which an electrodeof an electronic partis to be inserted. An external landis formed on a surface of each of the first and N-th layer patterns. An electrically conductive layeris formed on an inner wall of the through-holesuch that the electrically conductive layer is electrically connected to the external landof each of the first and N-th layer patterns. The electronic partis fixed in the through-holewith lead-free solderfilled in the through-hole. At least one internal landextending from the electrically conductive layeris formed in the same layer as a M-th layer pattern (2≦M≦(N−1)). The internal landis not electrically connected to the M-th layer pattern.