The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Jul. 31, 2003
Applicants:
Marty A. Grabham, McKinney, TX (US);
Brian Lance Clinton, Pottsboro, TX (US);
Inventors:
Marty A. Grabham, McKinney, TX (US);
Brian Lance Clinton, Pottsboro, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/00 ; H01L029/84 ; H01L035/00 ; H03F003/26 ;
U.S. Cl.
CPC ...
Abstract
A method of reducing package stress includes placing matched components of an op-amp substantially in a region of a die having the least stress gradients. The region is located in the center of the die. Further, the center is the common centroid of the die. The matched components are the current mirror input stages of the op-amp. In one embodiment, a semiconductor configuration includes a die having a region with the least stress gradients, and an op-amp containing matched components that are located substantially in the region.