The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
May. 20, 2004
Toshihisa Hara, Shimonoseki, JP;
Yasuhiro Shintani, Shimonosaki, JP;
Masayasu Nishimura, Shimonosaki, JP;
Ryoichi Ozaki, Shimonosaki, JP;
Masahiro Kawaguchi, Shimonosaki, JP;
Toshihisa Hara, Shimonoseki, JP;
Yasuhiro Shintani, Shimonosaki, JP;
Masayasu Nishimura, Shimonosaki, JP;
Ryoichi Ozaki, Shimonosaki, JP;
Masahiro Kawaguchi, Shimonosaki, JP;
Kobe Steel, Ltd., Kobe, JP;
Abstract
A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness of 0.1-1.0 μm and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 μm for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 μm for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.