The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2005

Filed:

Nov. 19, 2004
Applicant:

Wae-hai Tung, Marietta, GA (US);

Inventor:

Wae-Hai Tung, Marietta, GA (US);

Assignee:

Invista North America S.a.r.l., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01F006/00 ;
U.S. Cl.
CPC ...
Abstract

A bulked continuous filament with a three-sided exterior configuration is characterized in that each side has a smoothly curved contour extending between a first and a second rounded tip with an inwardly extending depressed region being disposed adjacent to each tip. Generally, the filament has an exterior modification ratio in the range from about 1.4 to about 2.0, and a tip ratio in the range from about 2.0 to about 4.0. The filament generally delta-shaped void with three major apices extending centrally and axially therethrough. Each side of the void is convexly shaped and formed from a pair of facets that meet to define minor apices. The void is oriented such that each major apex extends toward the approximate midpoint of one side of the exterior of the filament and each minor apex extends toward a tip of an exterior side. The distance (R) from the geometric center of the void to each major apex and the distance (R) from the geometric center of the void to each minor apex defines an apex ratio (R/R) in the range from about 1.0 to about 1.55. The void occupies from about four percent (4%) to about twenty-five percent (25%) of the cross sectional area of the filament.


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