The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Dec. 02, 2002
Yasushi Mizuta, Chiba, JP;
Tatsuji Murata, Chiba, JP;
Makoto Nakahara, Osaka, JP;
Takatoshi Kira, Osaka, JP;
Daisuke Ikesugi, Osaka, JP;
Yasushi Mizuta, Chiba, JP;
Tatsuji Murata, Chiba, JP;
Makoto Nakahara, Osaka, JP;
Takatoshi Kira, Osaka, JP;
Daisuke Ikesugi, Osaka, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Sharp Corporation, Osaka, JP;
Abstract
Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.