The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Oct. 28, 2003
Yi-ru Chen, YunLin, TW;
Kai-cheng Chang, Taipei, TW;
Guang-chyeng Fang, Hsinchu, TW;
Ming-hsiu Hsu, NanTou, TW;
Pei-fang Liang, YunLin, TW;
Yi-Ru Chen, YunLin, TW;
Kai-Cheng Chang, Taipei, TW;
Guang-Chyeng Fang, Hsinchu, TW;
Ming-Hsiu Hsu, NanTou, TW;
Pei-Fang Liang, YunLin, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An inertia device is constructed by both suspension structure and micro-electroplating structure. The suspension structure may be manufactured by surface micromachining technique of sacrificial layer process or bulk micromachining technique incorporating with thin film process. One side of the suspension structure is arranged firmly to a supporting piece, so that another side of the suspension structure is in a suspension state. The suspension side of the suspension structure is made as micro-electroplating structure through the micro-electroplating process and functions as inertia mass for an inertia sensor. The size of the micro-electroplating structure may be changed through the micro-electroplating process, such that the inertia sensor may be adapted for sensing in different levels. Furthermore, a microstructure of high aspect ratio may be achieved by taking the advantage of a metal during the selection of a processing material, such that the objective for lateral sensing or driving signal may be fulfilled.