The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Nov. 06, 2003
James J. Deblanc, Roseville, CA (US);
David Dickey, Roseville, CA (US);
Andrew Michael Cherniski, Rescue, CA (US);
James J. deBlanc, Roseville, CA (US);
David Dickey, Roseville, CA (US);
Andrew Michael Cherniski, Rescue, CA (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.