The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Nov. 12, 2004
Murray Steven Rodgers, Albuquerque, NM (US);
Samuel Lee Miller, Albuquerque, NM (US);
Murray Steven Rodgers, Albuquerque, NM (US);
Samuel Lee Miller, Albuquerque, NM (US);
Memx, Inc., Albuquerque, NM (US);
Abstract
Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad () configured for shadowing an exposed end (A) of a shielded interconnect line () connected to the bond pad () from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas () patterned from respective first, second and third layers () of material deposited on a substrate (). The exposed end (A) of the interconnect line () abuts an edge of the first bond pad area (). The third bond pad area () includes at least one tab portion () extending laterally from an edge of the third bond pad area () to shadow an area on the substrate () including the exposed end (A) of the interconnect line () abutting the edge of the first bond pad area ().