The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6936915 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 30, 2005

Filed:

Nov. 01, 2001
Applicant:

Katsufusa Fujita, Fukuoka, JP;

Inventor:

Katsufusa Fujita, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

A lead frame according to this invention comprises: a semiconductor chip mounting part having an engagement hole formed on its one side; and a lead part including a supporting lead fit in said engagement hole of the semiconductor chip mounting part so as to support said semiconductor chip mounting part, said supporting lead being made of a thinner-walled material than that of the semiconductor chip mounting part and an outer lead arranged in parallel to said supporting lead. The supporting lead involves a fitting portion having a wider width than a lead width of the supporting lead and fit in said engagement hole of said semiconductor chip mounting part.


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Fujita, Katsufusa. (2005). Lead frame having chip mounting part and leads of different thicknesses (U.S. Patent No. 6936915). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6936915

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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