The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2005

Filed:

Dec. 14, 2000
Applicants:

Frank Reichenbach, Reutlingen, DE;

Stefan Pinter, Reutlingen, DE;

Frank Henning, Reutlingen, DE;

Hans Artmann, Magstadt, DE;

Helmut Baumann, Gomaringen, DE;

Franz Laemer, Stuttgart, DE;

Michael Offenberg, Kirchentellinsfurt, DE;

Georg Bischopink, Pliezhausen, DE;

Inventors:

Frank Reichenbach, Reutlingen, DE;

Stefan Pinter, Reutlingen, DE;

Frank Henning, Reutlingen, DE;

Hans Artmann, Magstadt, DE;

Helmut Baumann, Gomaringen, DE;

Franz Laemer, Stuttgart, DE;

Michael Offenberg, Kirchentellinsfurt, DE;

Georg Bischopink, Pliezhausen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L029/82 ;
U.S. Cl.
CPC ...
Abstract

A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.


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