The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2005

Filed:

Oct. 04, 2001
Applicants:

John G. Woods, Farmington, CT (US);

Susanne D. Morrill, West Hartford, CT (US);

Jianzhao Wang, Ossining, NY (US);

Brendan J. Kneafsey, Dublin, IE;

Inventors:

John G. Woods, Farmington, CT (US);

Susanne D. Morrill, West Hartford, CT (US);

Jianzhao Wang, Ossining, NY (US);

Brendan J. Kneafsey, Dublin, IE;

Assignee:

Henkel Corporation, Rocky Hill, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07D303/12 ; C08G059/50 ; C08L063/02 ; H01L021/56 ; H01L023/29 ;
U.S. Cl.
CPC ...
Abstract

The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak α-alkoxy ester linkages which provide for the reworkable aspect of the invention.


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