Low temperature sinterable dielectric ceramic composition, multilayer ceramic chip capacitor and ceramic electronic device

Abstract

A low temperature sinterable dielectric ceramic composition, as well as a multilayer ceramic chip capacitor and a ceramic electronic device. The dielectric ceramic composition comprises a major composition represented by the general formula: x{αBaO, (1−α)SrO}-y{SiO}-z{(1−β)ZrO, β AlO} (wherein x, y and z are weight percentages; x+y+z=100, 55≦x≦75, 10≦y≦35, and 5≦z≦30, α and β are moles; 0.4≦α≦0.8, and 0.01≦β≦0.07) and 2 to 10 parts by weight of a Zn—B-silicate glass composition, per 100 parts by weight of the major composition. The multilayer ceramic chip capacitor and a multilayer ceramic circuit board for the electronic device comprise a plurality of dielectric ceramic layers, internal electrodes arrayed inside the dielectric ceramic layers, and outer electrodes electrically connected to the internal electrodes, characterized in that the dielectric ceramic layer is a sintered body of the dielectric ceramic composition mentioned above, and the internal electrode is made of a conductive base metal material.