The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Sep. 06, 2002
Kazuo Nishiyama, Kanagawa, JP;
Hiroshi Ozaki, Saitama, JP;
Yuji Takaoka, Kanagawa, JP;
Teruo Hirayama, Kanagawa, JP;
Kazuo Nishiyama, Kanagawa, JP;
Hiroshi Ozaki, Saitama, JP;
Yuji Takaoka, Kanagawa, JP;
Teruo Hirayama, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips.