The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Aug. 02, 2002
Shang-hyeun Park, Chungcheongnam-do, KR;
Deuk-seok Chung, Kyungki-do, KR;
Hang-woo Lee, Kyungki-do, KR;
Shang-hyeun Park, Chungcheongnam-do, KR;
Deuk-seok Chung, Kyungki-do, KR;
Hang-woo Lee, Kyungki-do, KR;
Samsung SDI Co., Ltd., Kyungki-do, KR;
Abstract
A method of fabricating a field emission display employing carbon nanotubes (CNTs) as electron emitters is provided. The method includes forming a cathode on a substrate; forming a gate insulation layer having a plurality of gate holes on the cathode; forming a gate electrode having a plurality of via-holes corresponding to the gate holes, respectively, on the gate insulation layer; forming a plurality of conductive columns higher than the gate electrode on the cathode within the respective gate holes; adhering the CNTs to the bottom of a plate template which is separately provided; bringing the bottom of the template having the CNTs to contact the tops of the conductive columns to adhere the CNTs to the tops of the conductive columns; and firing the conductive columns to lower the levels thereof. Accordingly, the problems of conventional methods, such as sinking of CNTs caused by screen printing, residual CNTs remaining within a gate when a lift-off method is used and short circuiting between gate and cathode due to the residual CNTs, can be solved. In addition, CNTs are applied to only a part for field emission, that is, only the top of a conductive column, thereby requiring fewer CNTs and decreasing fabrication cost. Moreover, the method uses stamping in order to form CNTs, so it is very advantageous in mass production.