The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Feb. 14, 2002
Masayuki Kondo, Shizuoka, JP;
Masayuki Kondo, Shizuoka, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
Intersected portions (C) of coated electric wiresand () are sandwiched and pressurized between a horn-side chip () and an anvil-side chip () (sandwiching step). Ultrasonic vibration force determined by a first vibration condition is applied to the horn-side chip () to melt insulators () and () of the coated electric wires () and () (insulator-melting step). A time point when conductors () and () of the coated electric wires () and () come into contact with each other is automatically detected by the melting of the insulators () and () (conductor contact-detecting step). After the conductors came into contact with each other, ultrasonic vibration force determined by a second vibration condition is applied to the horn-side chip (), thereby bonding the conductors () and () to each other (conductor-bonding step).