The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2005
Filed:
Oct. 01, 2003
Applicants:
Yung-chen Chen, Taoyuan, TW;
Chuan-cheng Huang, Taoyuan, TW;
Jia-jen Yeh, Taoyuan, TW;
Inventors:
Assignee:
Loyalty Founder Enterprise Co., Ltd., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D019/00 ; B22D027/09 ; B22D027/15 ;
U.S. Cl.
CPC ...
Abstract
A sink compound laminate molding process having a copper material in thickness of 0.1-0.8 mm placed at the bottom of the molding cavity with the bottom of the copper laminate fully bound to the bottom of the molding cavity, the copper being heated up to 300-600° C., and molten aluminum being filled into the molding cavity using a gravity casing process to create diffusion bonding to the interface between the copper and aluminum materials, molten aluminum being cooled and cured to avail an integrated compound laminate in a given profile of heterogeneous copper and aluminum.