The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2005

Filed:

Sep. 20, 2002
Applicants:

Shinichi Miyazaki, Kobe, JP;

Osamu Toda, Kobe, JP;

Yuichi Sano, Utsunomiya, JP;

Inventors:

Shinichi Miyazaki, Kobe, JP;

Osamu Toda, Kobe, JP;

Yuichi Sano, Utsunomiya, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P017/00 ;
U.S. Cl.
CPC ...
Abstract

A method for making a metallic cord made up of one or more metallic wires comprises: making at least two layers of at least two metallic elements including copper and zinc on the surface of a base wire; heating the layers to cause the metallic elements thermodiffusion to transform into a primary alloy layer; making a layer of copper on the primary alloy layer; drawing the wire provided with the primary alloy layer and outer copper layer into a metallic wire through dies so that the outer copper layer is diminished during passing through the dies, and a secondary alloy layer is formed as a result of transformation of the primary alloy layer and the outer copper layer which is caused by frictional heat during passing through the dies.


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