The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Mar. 16, 2001
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Junji Sakamoto, Gunma, JP;
Yukio Okada, Gunma, JP;
Yusuke Igarashi, Gunma, JP;
Eiju Maehara, Gunma, JP;
Kouji Takahashi, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Junji Sakamoto, Gunma, JP;
Yukio Okada, Gunma, JP;
Yusuke Igarashi, Gunma, JP;
Eiju Maehara, Gunma, JP;
Kouji Takahashi, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
The back surface of a semiconductor chip () is exposed from the back surface of an insulating resin (), and a metal plate () is affixed to this semiconductor chip (). The back surface of this metal plate () and the back surface of a first supporting member () are substantially within a same plane, so that it is readily affixed to a second supporting member (). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate () and the second supporting member ().