The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Jul. 12, 2002
Toshiya Satoh, Kanasago, JP;
Masahiko Ogino, Hitachi, JP;
Takao Miwa, Hitachinaka, JP;
Takashi Naitou, Mito, JP;
Takashi Namekawa, Hitachi, JP;
Toshiya Satoh, Kanasago, JP;
Masahiko Ogino, Hitachi, JP;
Takao Miwa, Hitachinaka, JP;
Takashi Naitou, Mito, JP;
Takashi Namekawa, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.