The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Nov. 25, 2002
Applicants:
Kenro Nakamura, Kamakura, JP;
Naoto Miyashita, Yokohama, JP;
Takashi Yoda, Machida, JP;
Katsuya Okumura, Tokyo, JP;
Inventors:
Kenro Nakamura, Kamakura, JP;
Naoto Miyashita, Yokohama, JP;
Takashi Yoda, Machida, JP;
Katsuya Okumura, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B001/00 ; H01L021/302 ;
U.S. Cl.
CPC ...
Abstract
In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the polishing member is slid on a polishing target surface of the periphery.