The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Apr. 15, 2004
Lim Peng Soon, Melaka, MY;
Chan Peng Yeen, Melaka, MY;
Lim Peng Soon, Melaka, MY;
Chan Peng Yeen, Melaka, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A wire bonding technique for manufacturing semiconductor devices that results in a bonded wire having a small loop height. The wire bonding technique involves a capillary tool that ball bonds a wire to a first contact point, then moves upwards, and then towards a second contact point to which the wire will be attached. The capillary tool only moves towards the second contact point in the lateral direction. The height of the wire loop of the bonded wires can be controlled to have desired wire loop heights. The bonding technique can be used in semiconductor devices with stacked dice and in devices where a die and a contact lead are approximately at the same height.