The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Jan. 13, 2004
Shaw Wei Lee, Cupertino, CA (US);
Nghia T. Tu, San Jose, CA (US);
Sadanand Patil, San Jose, CA (US);
Visvamohan Yegnashankaran, Redwood City, CA (US);
Shaw Wei Lee, Cupertino, CA (US);
Nghia T. Tu, San Jose, CA (US);
Sadanand Patil, San Jose, CA (US);
Visvamohan Yegnashankaran, Redwood City, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A method and apparatus for the dicing of semiconductor wafers using pressure to mechanically separate the individual die from the wafer without the use of a wafer saw. The method includes forming trenches along the scribe lines on a semiconductor wafer and then applying a mechanical pressure to the semiconductor wafer. The mechanical pressure causes a 'clean break' of the wafer along the scribe lines, thereby singulating individual die on the wafer. The apparatus comprises a pad for supporting a semiconductor wafer and a positioning member to position the semiconductor wafer on the pad. A pressure mechanism is provided to apply a mechanical pressure to the wafer so as to singulate the individual die on the wafer.