The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Feb. 24, 2003
Applicant:
Hiroyuki Tomimatsu, Sakata, JP;
Inventor:
Hiroyuki Tomimatsu, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/48 ; H01L021/50 ;
U.S. Cl.
CPC ...
Abstract
The invention provides a method for forming spacers very productively. A method for manufacturing a semiconductor wafer includes forming spacers on a plurality of semiconductor chips arranged in a plane on a substrate, respectively. The steps of forming the multiple spacers are conducted collectively on the substrate.
Tomimatsu, Hiroyuki. (2005). Semiconductor wafer with spacer and its manufacturing method, semiconductor device and its manufacturing method, and circuit substrate and electronic device (U.S. Patent No. 6933172). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6933172
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile