The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Apr. 09, 2003
Makoto Nishizawa, Shizuoka-ken, JP;
Toshihiro Kasai, Shizuoka-ken, JP;
Kazuhito Kobayashi, Shizuoka-ken, JP;
Yukio Iimura, Shizuoka-ken, JP;
Makoto Nishizawa, Shizuoka-ken, JP;
Toshihiro Kasai, Shizuoka-ken, JP;
Kazuhito Kobayashi, Shizuoka-ken, JP;
Yukio Iimura, Shizuoka-ken, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Abstract
Method for mold clamping of the present invention is capable of shortening a molding cycle without any initial setting works for an engaging position of a tie bars. The method is constituted the steps of moving the tie bars in the direction of mold closing during mold close operation, judging a relative moving speed between a movable die plate and the tie bar to be within a predetermined value, engaging the tie bars with the movable die plate mechanically by operating an engaging means when the relative moving speed is judged to be within the value, then further moving the movable die plate against a fixed die plate under engagement, and after contact of a movable mold with a fixed mold driving a mold clamping cylinder, thereby executing mold clamping operation.