The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2005

Filed:

Oct. 22, 2003
Applicants:

William G. Marancik, Ebony, VA (US);

Seung Hong, New Providence, NJ (US);

Inventors:

William G. Marancik, Ebony, VA (US);

Seung Hong, New Providence, NJ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F001/16 ; H01L039/24 ; C25D005/50 ; C25D007/00 ;
U.S. Cl.
CPC ...
Abstract

A method for producing a superconductor having a high copper to superconductor composition (Cu/SC) ratio by cross-sectional area. An assembly is prepared formed of one or more fine filaments of a superconductor composition or of a precursor component for a superconductor alloy composition, which filaments are embedded in a copper-based matrix. The assembly is electroplated with copper to increase the Cu/filament ratio in the resulting product, and thereby increase the said Cu/SC ratio to improve the stability of the final superconductor.


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