The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Oct. 24, 2003
Hung Chang Hsieh, Taoyuan Hsien, TW;
Chih-chi Wu, Taoyuan Hsien, TW;
Jui-yuan Hsu, Taoyuan Hsien, TW;
Chih-jen Chen, Taoyuan Hsien, TW;
Min-kuang Chang, Taoyuan Hsien, TW;
Hung Chang Hsieh, Taoyuan Hsien, TW;
Chih-Chi Wu, Taoyuan Hsien, TW;
Jui-Yuan Hsu, Taoyuan Hsien, TW;
Chih-Jen Chen, Taoyuan Hsien, TW;
Min-Kuang Chang, Taoyuan Hsien, TW;
Delta Electronics, Inc., Taoyuan Hsien, TW;
Abstract
A heat-dispersing module of an electronic device is disclosed. The heat-dispersing module includes: a housing having a top surface, a bottom surface, a first side surface and a second side surface, wherein the first side surface is opposite to the second side surface; a heat-dispersing fan mounted on the first side surface of the housing; a first vent area disposed on the second side surface of the housing; a second vent area disposed on the top surface of the housing; and a printed circuit board positioned in the housing, thereby a first airflow channel is formed between the top surface of the housing and the printed circuit board and a second airflow channel is formed between the bottom surface of the housing and the printed circuit board, wherein the printed circuit board produces a relatively higher heat at the second airflow channel than the first airflow channel and a distance of the second airflow channel from the printed circuit board to the bottom surface is relatively larger than that of the first airflow channel from the printed circuit board to the top surface.